Welcome to Hilbond!

We develop and manufacture die bonder, which meet high standards of accuracy and flexibility, yet are easy to operate.

The absence of a die bonder in the market, which is flexible enough to put just about individual chips without much effort and yet can be programmed so that the die bonding runs automatically, led the Swiss specialists Hilpert electronics to the decision to invest in a new development.
In a joint venture with Solderbond, Hilbond was founded 2005. The product - the DB750 - have been successfully launched after several years of development and testing and is now supplemented by interesting features.